Most Advanced Tabletop Laser Direct Imager

Projects computer-aided design data directly onto photosensitive layers. It bypasses physical photomasks to achieve high-precision patterning for advanced IC packaging substrates.

High-density interconnect (HDI) boards, Flexible and rigid-flex PCBs, Dense PCBs and simple chip designs with precise alignment can be realized through a combination of lithographic steps and further chemical or other processing steps. Simple silicon chip designs can be tested on whole wafer substrates, as holders can be exchanged for 2” to 4” diameters. DaLI supports standard photoresist materials, offering an option to integrate into existing prototyping and manufacturing facilities.

Lithographic structures can be prepared on virtually any material with sufficiently low roughness, either directly or with the help of bonding agents in the form of sputtered thin metal layers or dried chemicals. Lithography serves for either creating a mask for further etching steps (i.e. for silicon-based MEMS) or for direct structuring of thick photoresists, creating mechanical components made of photoresist materials. High precision and repeatability are necessary for reliable micromechanical components, both delivered by DaLI’s Acoustio Optic Deflectors (AOD) with integrated control systems. High aspect ratio microstructures, such as gears, mixers and valves, can be created through the use of the coarse tool setting, enlarging the vertical reach, but keeping walls smooth. LDI improves precision and reduces distortion in pattern transfer in a PCB.

Various electrodes and other designs can be transferred to a single micro crystal, mono layers and other demanding surfaces. With laser lithography various electrodes and other designs can be transferred to a single micro crystal, mono layers and other demanding surfaces.

Precise, nm resolution design with smooth edges and sub micrometer features can be realized Accurate positioning and designs of structures based on targeted object’s (crystal, fiber, flake) position, shape and size are possible — markers or additional alignment features are not required.

Candidates and their thickness (crystals, flakes etc.) can be identified and differentiated in situ employing color microscope integrated

Microfluidic customized channels embossed in PDMS or similar materials can exhibit high-aspect ratios, smooth walls, and well-defined corners, as well as potentially structured walls to manipulate flows of liquids or particles. Our coarse tool offers higher processing speeds compared to fine tool as a consequence of using a larger laser spot size on material but achieves equally smooth channel wall as well as minimal deviations from vertical sides in case of thick photoresists.

Large overall scale, demanded due to necessary connections to external pumps and reservoirs, is quickly achieved with the use of the coarse tool. Large scale structures and single micrometer scale channels are seamlessly connected with automated stitching. Pattern photosensitive Biological Scaffolds, Tissue Engineering or microfluidic channels with micrometer-level precision.

Miniaturized laboratories, enabling various biological or chemical reactions taking place on a mm-cm scale substrate, are already a staple for in-situ detection methods and diagnostics in remote areas. Multiple laboratory functions need to be integrated on a single lab-on-a-chip device, often combining Microfluidics, Micromechanical and Micro electrical components, thus facilitating the need of controlled Centimeter scale structuring with the ability to define Micrometer scale details. Also for Cell sorting applications.

Highly precise lithographic structures are needed for a high-quality final device, in order to avoid leaks and jams in the contained flows. Non-contact methods of sample mounting, positioning, and structure illumination in DaLI serve to maintain a clean microscale environment.

Green Laser-Induced Graphene (LIG) is a sustainable technology that uses direct laser writing to convert renewable bio-based materials—such as lignin, chitosan, and cork—into porous, conductive graphene. This eco-friendly method replaces standard synthetic plastic precursors with natural carbon sources to build flexible electronics and Biosensors. various inexpensive flexible polymer substrates, mainly polyimide are scribed through laser irradiation and Laser Induced Graphene (LIG) materials are produced Laser-induced graphene (LIG) sensors are flexible, porous carbon devices made by using a laser to turn polymer films (like polyimide) into graphene. They measure physical and chemical changes, feature a fast, low-cost production method, and work well for wearable health monitors. Sensors can be drawn right onto a flexible base directly without any Photomask.

Photoresist materials can either directly serve as a base layer for biophysical experiments, with surfaces modified through lithographic steps, or can be used to emboss the textured surface to other biocompatible materials. Photoresist surface texturing is achieved with precise control of illumination parameters, resulting in various textures exhibiting different physical properties to control flows, biocompatibility, or friction.

Hierarchically organized surface structures and single-micron scale two-dimensional array patterns, both realized in thin photoresists, act as in-vitro simulations of real life complex biological systems.

Is increasingly employed as a thermochemical tool for direct material conversion, such as localized pyrolysis. This method utilizes renewable and low-cost lignin as a carbon precursor, which undergoes localized pyrolysis through laser irradiation to successfully fabricate 3D porous lignin-derived laser-induced graphene (LSG). Irradiate the targeted areas of the lignin film; high localized heat vaporizes volatile gases and rearranges the aromatic lignin structures into a conductive, 3D hierarchically porous graphene network. Fabricated 3D graphene electrodes on the surface of lignin films by laser in situ writing, which opens up a new way for large-scale and low-cost manufacturing of flexible electronic devices and micro supercapacitors